Item | Content | Maximum |
---|---|---|
Layer | Layer count | 12L |
HDI | NA | |
Pattern | Pattern width / spacing | 3.5mil*3.5mil |
Process capability | Tolerance of Board Thickness | 0.06 |
Layer to layer registation | 2.5mil | |
True position tolerance | 2.5mil | |
Min finished hole size | 0.1mm | |
Aspect ratio (H:T) | 0.1:10 | |
Copper plating uniformity | R≦0.20mil | |
PAD to line spacing | 3.5mil | |
Min. S / M dam | MIN:3mil | |
Legend width | MIN:3mil | |
Heavy Copper (OZ) | 2oz | |
Surface finish | Gold plating | ○ |
ENIG | ○ | |
OSP | ● | |
HASL | ○ | |
Carbon | ○ | |
Immersion silver | ○ | |
Immersion tin | ○ | |
Resin plugging / cap plating | ○ |
NO | Items | Capability |
---|---|---|
1 | Material | Aluminum base,Copper base,Iron base,Combined Base |
2 | Material type | Domestic & Imported material |
3 | Surface treatment | LF HAL,immersion Tin,ENIG,OSP,silver plating |
4 | Layer | Layer |
5 | Max size | 1200mmX480mm |
6 | Min size | 5mmX5mm |
7 | Line width & gap | 0.1mm/0.1mm |
8 | Warp&twist | <=0.5%(thickness:1.6mm,outline:300mmX300mm) |
9 | Board thickness | 0.3mm-4.5mm |
10 | Copper thickness | 35um/70um/105um/140um |
11 | Outline tolerance | CNC routing:+/-0.1mm;Punching:+/-0.05mm |
12 | V-CUT postiong precision | +/-0.15mm |
13 | Copper wall thickness | 20um-25um |
14 | Hold postion tolerance (Compare to CAD date) | ±3mil (±0.076mm) |
15 | Min.punching hole diameter | Board thickness less than 1.0mm : Dia.1.0mm |
16 | Min.square pnching hole size | Board thickness less than 1.0mm : 1.0mmX1.0mm |
17 | Silkscreen printing deviation | +/-0.076mm |
18 | Min.drilling hole size | 0.6mm |
19 | Surface treatment thickness | Gold plating : NIi4um-6um , Au:0.1um-0.5um ENIG : Ni5um-6um , Au : 0.0254um-0.127um Silver plating : Ag:5um-8um OSP:1-3um LF HAL : 10um-100um |
20 | V-CUT angular deviation | +/-5 degree |
21 | board thickness range for V-cut | 0.6mm-3.2mm |
22 | Min. legend width | 0.15mm |
23 | Min.solder mask openning | 0.1mm |
NO | Items | Capability |
---|---|---|
1 | Layer Counts | 1-4 Layers |
2 | Working Panel Size (Max) | 250mm×500mm |
3 | Track spacing and width (Min) | 0.045mm / 0.045mm (1.8mil / 1.8mil) |
4 | Sunface treatment | 化金,电金,OSP,化锡 etc. |
5 | Board Thickness (Min) | 0.05mm (2mil) |
6 | Finished Hole Diameter (Min) | ф0.1mm |