製程能力
PCB
| Item | Content | Maximum |
|---|---|---|
| Layer | Layer count | 12L |
| HDI | NA | |
| Pattern | Pattern width / spacing | 3.5mil*3.5mil |
| Process capability | Tolerance of Board Thickness | 0.06 |
| Layer to layer registation | 2.5mil | |
| True position tolerance | 2.5mil | |
| Min finished hole size | 0.1mm | |
| Aspect ratio (H:T) | 0.1:10 | |
| Copper plating uniformity | R≦0.20mil | |
| PAD to line spacing | 3.5mil | |
| Min. S / M dam | MIN:3mil | |
| Legend width | MIN:3mil | |
| Heavy Copper （OZ） | 2oz | |
| Surface finish | Gold plating | ○ |
| ENIG | ○ | |
| OSP | ● | |
| HASL | ○ | |
| Carbon | ○ | |
| Immersion silver | ○ | |
| Immersion tin | ○ | |
| Resin plugging / cap plating | ○ |
●Own Productions
MCPCB
| NO | Items | Capability |
|---|---|---|
| 1 | Material | Aluminum base,Copper base,Iron base,Combined Base |
| 2 | Material type | Domestic & Imported material |
| 3 | Surface treatment | LF HAL，immersion Tin，ENIG，OSP，silver plating |
| 4 | Layer | Layer |
| 5 | Max size | 1200mmX480mm |
| 6 | Min size | 5mmX5mm |
| 7 | Line width & gap | 0.1mm/0.1mm |
| 8 | Warp&twist | <=0.5%(thickness:1.6mm，outline:300mmX300mm) |
| 9 | Board thickness | 0.3mm-4.5mm |
| 10 | Copper thickness | 35um/70um/105um/140um |
| 11 | Outline tolerance | CNC routing：+/-0.1mm；Punching：+/-0.05mm |
| 12 | V-CUT postiong precision | +/-0.15mm |
| 13 | Copper wall thickness | 20um-25um |
| 14 | Hold postion tolerance (Compare to CAD date) | ±3mil (±0.076mm) |
| 15 | Min.punching hole diameter | Board thickness less than 1.0mm : Dia.1.0mm |
| 16 | Min.square pnching hole size | Board thickness less than 1.0mm : 1.0mmX1.0mm |
| 17 | Silkscreen printing deviation | +/-0.076mm |
| 18 | Min.drilling hole size | 0.6mm |
| 19 | Surface treatment thickness | Gold plating : NIi4um-6um , Au:0.1um-0.5um ENIG : Ni5um-6um , Au : 0.0254um-0.127um Silver plating : Ag:5um-8um OSP:1-3um LF HAL : 10um-100um |
| 20 | V-CUT angular deviation | +/-5 degree |
| 21 | board thickness range for V-cut | 0.6mm-3.2mm |
| 22 | Min. legend width | 0.15mm |
| 23 | Min.solder mask openning | 0.1mm |
FPCB
| NO | Items | Capability |
|---|---|---|
| 1 | Layer Counts | 1－4 Layers |
| 2 | Working Panel Size (Max) | 250mm×500mm |
| 3 | Track spacing and width (Min) | 0.045mm / 0.045mm (1.8mil / 1.8mil) |
| 4 | Sunface treatment | 化金,电金,OSP,化锡 etc. |
| 5 | Board Thickness (Min) | 0.05mm (2mil) |
| 6 | Finished Hole Diameter (Min) | ф0.1mm |